适用制程Applicable process

SMT锡膏印刷后，回流焊前及回流焊后

SMT solder paste printing,
reflow reflow soldered
before and after

检测方法Test method

彩色图像学习、统计分析 .字符自动识别(OCR),颜色距离分析,IC桥接分析 ,黑白比重分析,亮度分析,相似度分析

Color images learning,Statistical analysis,
Automatic character recognition (OCR),Color distance analysis,IC bridge analysis,Black and white and the hydrometer analysis,
Brightness analysis,Similarity analysis

摄像系统Image pickup system

彩色CCD智能数字相机

Color CCD intelligent digital camera

分辨率Resolution

20μm，15μm，10μm

照明系统Illuminating system

环形塔状高亮度三色LED照明

（R.G.B)Circular tower shaped high brightness LED lighting three color（R.G.B)

编程方法Programming method

快速手动编程，CAD坐标自动搜索元件库导入

Fast promgamming，
CAD coordinates auto search compoment library

检查项目Inspection Items

锡膏印刷：有，无，偏斜，少锡，多锡，短路，污染

The printing: yes, no, skewed, little tin,
 tin, and short circuit, pollution

元件检查：缺件，偏移，歪斜，立碑，侧立，翻件，极性反，错件，破损，AI元件弯曲等。

Components inspection: missing parts,
 migration, skewed, made up, turn piece,
side against, wrong thing, polarity, damaged,AI component bends.

焊点检查：锡多，锡少，连锡，锡珠，铜箔污染，波峰焊插件焊点检查

Solder joint inspection:
tin much, tin tin tin, even less pollution,
 ul bead, soldering plugin solder joints inspection

最小元件测试Minimum component test

01005chip,0.25pitchIC

SPC统计系统SPC statistical system

记录测试数据进行统计分析，Excel输出格式查看生产品质情况

Record test data of statistical analysis,
Excel output format check production quality

条码系统Barcode system

相机自动识别

Camera automatically identify

操作系统Operating system

Windows XP,Windows 7

远程控制Remote control

使用网络远程操作，简便快捷修改程序及排除故障

Using the network remote operation,
simple and rapid modify the program and
trouble-shooting

测试结果Test results

通过22英寸液晶显示器显示NG具体位置

24 inch LCD display through
physical location. NG