IC半导体LED封装检测解决方案WB&DB焊线AOI检测设备
型号：F241/F251
主要特征 ：
1. 可选的5面和6面检查
2. 2.5D深度技术
3. 模块化且灵活
4. 64位操作系统
5. 至强处理器
6. 吞吐量从20,000上升到50,000上升
7. 相机分辨率范围从75 fps时的5百万像素到66fps时的12百万像素
应用范围：
1. 晶圆切割后进行检查以检测表面缺陷。
2. 封装分离后进行检查，以检测封装，标记，引线和电镀缺陷。
TTVISION自动光学检测设备的检测方式
*2D
*2.5D
*True 3D (Z5D)
F251
Wirebond AOI Machine
Features
3D Profiling Technology
Inspects Wire bond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Ball. Wedge. Stitch and Loop Parameters
Minimum Overkill & Underkill
Modular end Scalable Design
Cost Effective
High Throughput
F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts
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2D AOI技术规格
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·onload /Offload
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Number of Magazines
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2-7 units
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Substrate Size
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30(W) x 150(L) - 200(W) x 300(L)mm
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Handling
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Camera Indexing
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High Speed Servo driven XY Gantry
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Substrate Indexing
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Micro-Step Stepper driven Conveyor
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·Inspection Hardware
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Camera Resolution
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12MP Color
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Lighting
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Multi Channel LED
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Optics
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Low Distortion Macro Lens
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Controller
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PC-based
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·Software
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Inspection Software
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TTVISION ©
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·Operating System
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MS Windows 64 bit OS
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·Reject Handling
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Electronic Mapping
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Defect Classification
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99 Categories
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