| 用于微电子器件封装的环氧导电胶
CHO-BOND 700，CHO-BOND SV712，CHO-BOND SV713
50-00-SV712-0000，50-01-SV712-0000，50-04-SV712-0000，50-17-SV712-0000，50-38-SV712-0000，50-00-SV713-0000，50-01-SV713-0000
通用环氧导电胶
66-10-0200-T441-18 .018" X 2.00" X 100LF W/PSA 66-10-0800-1674 8.00" ROLL 100 LF 66-10-1000-T710 10.00" ROLL, 100 FT 66-10-1100-T441-08 11.00" ROLL X .008" 100 LF 66-10-1100-T441-13 11.00" X .013" ROLL 100 LF 66-10-1100-T441-18 11"', .018" T441 W/ PSA 66-10-1100-T609 11" ROLL X 100 LF W/PSA 66-10-1200-1646 12.00" ROLL 100 LF 66-10-1200-1680 12.00" ROLL, 100 LF 66-10-1200-T444 12.00" ROLL 100LF 66-10-1600-1674 16.00" ROLL 100 LF 66-10-2000-T710 20" ROLL X 100 LF 用于微电子器件封装的环氧导电胶 CHO-BOND 700,CHO-BOND SV712,CHO-BONDSV71350-00-SV712-0000,50-01-SV712-0000,50-04-SV712-0000,50-17-SV712-0000,50-38-SV712-0000,50-00-SV713-0000,50-01-SV713-0000通用环氧导电胶 CHO-BOND 500,CHO-BOND30050-10-0584-0029,50-02-0584-0029,50-03-0584-0029,50-01-0584-0029,50-00-0584-0029,50-10-0584-0208,50-00-0584-0029,50-01-0592-0000,50-00-0592-0000,50-01-0360-0020,50-01-0360-0208,50-00-0360-0208双成分硅脂导电胶 CHO-BOND 102950-01-1029-0000,50-00-1029-0000,50-01-1085-0000 单成分硅脂导电胶 CHO-BOND1030,CHO-BOND 103550-01-1030-0000,50-02-1030-0000,50-01-1035-0000,50-00-1035-0000,50-01-1075-0000,50-02-1075-0000,50-01-1086-0000刚性环氧树脂填充剂 50-01-0360-0020,50-01-0360-0208,50-00-0360-0208硅酮和柔性聚异乙烯 CHO-BOND 1035, 50-01-1035-0000, CHO-BOND 1035,50-00-1035-0000,CHO-BOND 1038, 50-01-1038-0000, CHO-BOND 1038,50-00-1038-0000, CHO-BOND 1075,50-01-1075-0000, CHO-BOND 1075,50-00-1075-0000, CHO-BOND 4660, 50-05-4660-0000,CHO-BOND 4660,50-02-4660-0000 导电胶 CHOMERICS PARKER50-02-0584-0029 2.5g 环氧 银 导电胶 CHOMERICS PARKER50-02-1030-0000 113g 硅酮 银铜 导电胶 CHOMERICS PARKER50-02-1030-0000 113g 硅酮 银铜 导电胶 CHOMERICS PARKER50-02-1030-0000 113g 硅酮 银铜 导电胶 CHOMERICS PARKER50-02-1030-0000 113g 硅酮 银铜 导电胶 CHOMERICS PARKER50-10-0584-0029 1g 环氧 银 导电胶 CHOMERICS PARKER50-10-0584-0029 1g 环氧 银 导电胶 CHOMERICS PARKER50-10-0584-0029 1g 环氧 银 导电胶 CHOMERICS PARKER50-10-0584-0029 1g 环氧 银 导电胶 CHOMERICS PARKER51-02-4669-0000 113g 银铜 导电胶 CHOMERICS PARKER51-02-4669-0000 CHO-BOND4669 银铜填缝剂 导电漆 CHOMERICS PARKERSP-029 银包铜 导电漆 CHOMERICS PARKERSP-017 银包铜 65-00-T630G-0300 300 CC T630G 65-00-T630G-0360 360 CC CARTRIDGE USE 180/300CC 65-00-T635-0010 10 CC T635 SYRINGE 65-00-T635-0030 30 CC CARTRIDGE 65-00-T635-0180 180 CC CARTRIDGE 65-00-T635-0300 300 CC CARTRIDGE 65-00-T635-0360 360 CC CARTRIDGE USE 180/300CC 65-00-T636-0010 10 CC SYRINGE 30 CC CARTRIDGE 65-00-T636-0180 180 CC CARTRIDGE 65-00-T636-0300 300 CC CARTRIDGE 65-00--0035 T642 35 CC KITS 65-00-T642-0177 T642 177 CC KIT 65-00-T642-0250 T642 250 CC KITS 65-00-T644-0045 T644 45 CC KIT 65-00-T644-0200 T644 200 CC KIT 65-00-T644G-0045 T644G 45 CC KIT W/GLASS BEADS 65-00-T646-0045 T646 45CC KIT 65-00-T646-0200 T646 200 CC KIT 65-00-T650-0015 15 CC SYRINGE T650 65-00-T650-0030 30 CC SYRINGE T650 65-00-T650-3790 3790 CC T650, 1 GALLON PAIL 65-00--0015 15 CC SYRINGE T660 65-00-T660-0030 30 CC SYRINGE T660 65-00-T660-3790 3790 CC T660, 1 GALLON PAIL 65-00-T670-0300 300 CC SYRINGE T670 65-00-T670-3790 3790 CC T670, 1 GALLON PAIL 65-01-1641-0000 SEALANT/ADHESIVE, 12 OZ CART. 65-01-1641-0000 NP SEALANT/ADHESIVE,12OZ/NO PRIMR 66-05-1200-1646 12.00" ROLL 50 LF 66-10-0100-T710 1.00" ROLL, 100LF 用于微电子器件封装的环氧导电胶CHO-BOND 700，CHO-BOND SV712，CHO-BONDSV713 50-00-SV712-0000，50-01-SV712-0000，50-04-SV712-0000，50-17-SV712-0000，50-38-SV712-0000，50-00-SV713-0000，50-01-SV713-0000 通用环氧导电胶 CHO-BOND500,CHO-BOND 300 50-10-0584-0029,50-02-0584-0029,50-03-0584-0029,50-01-0584-0029,50-00-0584-0029,50-10-0584-0208,50-00-0584-0029,50-01-0592-0000,50-00-0592-0000,50-01-0360-0020,50-01-0360-0208,50-00-0360-0208双成分硅脂导电胶 CHO-BOND 102950-01-1029-0000,50-00-1029-0000,50-01-1085-0000 单成分硅脂导电胶 CHO-BOND 1030,CHO-BOND 1035 50-01-1030-0000,50-02-1030-0000,50-01-1035-0000,50-00-1035-0000,50-01-1075-0000,50-02-1075-0000,50-01-1086-0000刚性环氧树脂填充剂50-01-0360-0020,50-01-0360-0208,50-00-0360-0208 硅酮和柔性聚异乙烯CHO-BOND 1035, 50-01-1035-0000, CHO-BOND 1035, 50-00-1035-0000,CHO-BOND 1038, 50-01-1038-0000, CHO-BOND 1038, 50-00-1038-0000, CHO-BOND 1075,50-01-1075-0000, CHO-BOND 1075, 50-00-1075-0000, CHO-BOND 4660,50-05-4660-0000, CHO-BOND 4660, 50-02-4660-0000, CHO-BOND 4669,50-05-4669-0000, CHO-BOND 4669, 50-02-4669-0000 环氧树脂涂料CHO-BOND596,50-01-0596-0000,CHO-BOND 596,50-00-0596-0000,CHO-BOND 610,50-03-0610-0000 聚氨酯脂涂料 CHO-SHIELD 4076 52-03-4076-050A 聚丙乙烯涂料CHO-SHIELD 2052 52-02-2052-0000 , CHO-SHIELD 2052 52-03-2052-0000 , CHO-SHIELD2052 52-05-2052-0000 , CHO-SHIELD 2054 52-03-2054-0000 , CHO-SHIELD 205452-05-2054-0000 , CHO-SHIELD 2056 52-03-2056-0000 , CHO-SHIELD 205652-05-2056-0000 , CHO-SHIELD 4900 52-01-4900-0000 , CHO-SHIELD 490052-02-4900-0000 , CHO-SHIELD 4900 52-03-4900-0000 , CHO-SHIELD 491452-03-4914-0000 , CHO-SHIELD 4916 52-03-4916-0000 防腐的尿烷导电法兰涂料CHO-SHIELD 2001 52-00-2001-0000,CHO-SHIELD 2001 52-01-2001-0000 ,CHO-SHIELD 2001 52-04-2001-0000 , CHO-SHIELD 2002 52-00-2002-0000 , CHO-SHIELD2002 52-01-2002-0000 , CHO-SHIELD 2002 52-04-2002-0000 , CHO-SHIELD 200352-00-2003-0000 , CHO-SHIELD 2003 52-01-2003-0000 , CHO-SHIELD 200352-04-2003-0000 , CHO-SHIELD 1091 52-00-1091-0000 CHO-FLEX柔性涂料和油墨 CHO-FLEX 601 52-01-0601-0000，CHO-FLEX 443052-01-4430-0000 可涂布热凝胶65-00-T6XX-0010 ,10CC样品 65-00-T6XX-0030 ,30CC芯料 65-00-T6XX-0180 ,180CC芯料 65-00-T6XX-0300 ,300CC芯料 69-11-24419-T630,25kg套件 69-11-25177-T630 ,1加仑桶(5kg) 硅橡胶导热填充剂65-00-1641-0000, 65-01-1641-0000 ,65-00-1642-0000 , 65-00-T642-0035 , 65-00-T642-0250 , 65-00-T644-0045 ,65-00-T644-0200 , 65-00-T646-0045 , 65-00-T646-0200 , 65-00-T647-0045 ,65-00-T647-0200 导热脂/导热胶 导电橡胶板40-10-1020-1350， 40-10-1020-1350 ，40-10-1015-1350，40-10-1520-1350，10-04-1687-1350
导电胶 CHOMERICS PARKER50-01-1075-000-55 5EA 导电胶 CHOMERICS PARKER50-02-1038-000-55 5EA 导电胶 CHOMERICS PARKER50-02-1030-000-55 5EA 导电胶 CHOMERICS PARKER50-03-0584-0029 10g 环氧 银 包装：114克/套 三、技术规格列表 PARKER环氧导电胶 50 PARKER硅脂导电胶 50-02-1030-000-55 5EA PARKER环氧导电胶 50-03-0584-0029 10g PARKER环氧导电胶 50-02-0584-0029 2.5g PARKER硅脂导电胶 50-02-1030-0000 113g PARKER环氧导电胶 50-10-0584-0029 1g PARKER硅脂导电胶 51-02-4669-0000 113g PARKER环氧导电胶 51-02-4669-0000 CHO-BOND4669 PARKER环氧导电胶 SP-029 PARKER环氧导电胶 SP-017 CHOMERICS硅脂导电胶50-02-1030-000-55 5EA CHOMERICS环氧导电胶50-03-0584-0029 10g CHOMERICS环氧导电胶50-02-0584-0029 2.5g CHOMERICS环氧导电胶50-10-0584-0029 1g CHOMERICS硅脂导电胶51-02-4669-0000 113g CHOMERICS环氧导电胶51-02-4669-0000 CHO-BOND4669 CHOMERICS环氧导电胶 SP-029 CHOMERICS环氧导电胶 SP-017 导电胶 CHOMERICS PARKER 50-02-1030-000-55 5EA 导电胶 CHOMERICS PARKER 50-03-0584-0029 10g 环氧银 导电胶 CHOMERICS PARKER 50-02-0584-0029 2.5g 环氧银 导电胶 CHOMERICS PARKER 50-02-1030-0000 113g 硅酮银铜 导电胶 CHOMERICS PARKER 50-10-0584-0029 1g 环氧银 导电胶 CHOMERICS PARKER 51-02-4669-0000 113g 银铜密封胶 导电胶 CHOMERICS PARKER 51-02-4669-0000 CHO-BOND4669 银铜填缝剂 导电漆 CHOMERICS PARKER SP-029 银包铜 导电漆 CHOMERICS PARKER SP-017 银包铜 PARKER环氧导电胶 50-01-1075-000-55 5EA PARKER环氧导电胶 50-02-1038-000-55 5EA PARKER硅脂导电胶 50-02-1030-000-55 5EA PARKER环氧导电胶 50-03-0584-0029 10g PARKER环氧导电胶 50-02-0584-0029 2.5g PARKER硅脂导电胶 50-02-1030-0000 113g PARKER硅脂导电胶 50-02-1030-0000 113g PARKER硅脂导电胶 50-02-1030-0000 113g PARKER硅脂导电胶 50-02-1030-0000 113g 固美丽) Parker 代理商 昆山嘉禄博 环氧导电胶是由高粘接强度的环氧胶和高导电的银颗粒巧妙地组合在一起。具有室温固化、粘接强度高、导电温度性优宽范围、操纵简便等多项优点。 应用：金属与金属粘接、印刷线路板线路连接、微波元器件引线连接、金属丝网屏蔽条粘接 使用方法：10克以下的导电胶，去掉配制好的双组份的隔挡，混合均匀既可使用。85可以上的导电胶，需与固化挤按重量100：6.3配比，混合均匀既可使用。 技术参数： 体电阻：0.002Ω 粘接剪切强度：84kg/cm2 工作温度： -55℃～125℃ 操作时间：30分钟 温室固化时间（25℃）：24小时 高温固化时间（113℃）：15分钟 存贮期：3年 涂覆面积：156cm2/g 二、硅脂导电胶 其中1030是一种但成分RTV硅酮，它暴露在中等潮湿环境下固化，具有2倍与其他RTV硅酮的撕裂强度和200psi（1.38MPa）的搭接剪切强度。为了最高的导电率，粘合层厚度不应超过10mil。为了正确的固化，宽度不应该超过0.5in（1.27cm）。材料在1-2psi（0.01Mpa）标准压力和不超过66℃的温度下固化。 应用：导电橡胶板与金属粘接、导电橡胶条与金属粘接 使用方法：一定要将需要粘接的表面清洗干净后，后按规定操作。 技术参数： 体电阻：0.05Ω 剥离强度：14Kg/cm2 工作温度：-55℃～200℃ 操作时间：30分钟 温室固化时间：7天 存储期：6个月 粘接面积：18.5cm2/g 胶粘接厚度：小于等于0.03mm | 
